DACA Engineer

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

DACA Engineer (Die Attach Process Engineer)

The DACA Engineer is responsible for developing, optimizing, and sustaining die attach manufacturing processes to achieve high product quality, reliability, and manufacturing efficiency. The engineer will collaborate with cross-functional teams to drive process improvements, resolve technical issues, support new product introductions, and ensure stable production performance.

Role And Key Responsibilities

The successful candidate will focus on die attach assembly processes within semiconductor manufacturing. This includes process development, troubleshooting, yield improvement initiatives, equipment optimization, and supporting new package qualifications.

Scope of Daily Tasks

• Monitor and sustain die attach manufacturing processes to ensure stable production performance.
• Analyze process trends, yield excursions, and defect data to identify improvement opportunities.
• Lead root cause investigations and implement effective corrective and preventive actions.
• Support new product introductions, process qualifications, and engineering evaluations.
• Define and execute process characterization studies and DOE (Design of Experiments).
• Collaborate with equipment suppliers and internal teams to improve equipment capability and utilization.
• Prepare technical reports, work instructions, and process documentation.
• Drive continuous improvement projects targeting cost, quality, productivity, and cycle time reduction.
  
  
  

Candidate Profile

Preferred Degree / Education

• Bachelor's Degree in Mechanical Engineering, Electrical & Electronic Engineering, Materials Engineering, Manufacturing Engineering, Chemical Engineering, or equivalent technical discipline.
• Master's degree is an added advantage.
  
  
  

Experience Level

• Minimum 5–8 years of experience in semiconductor assembly manufacturing.
• Direct experience in Die Attach / DACA processes is highly preferred.
• Senior candidates with extensive technical expertise may be considered for advanced roles.
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.