Engineer III (Diebond)

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

About The Role

As a Development Die Bond Engineer, you will be responsible for developing, qualifying, and industrializing new die attach technologies, processes, materials, and equipment for semiconductor packaging applications. You will play a key role in bringing new products and advanced packaging solutions from concept to high-volume manufacturing.

Working closely with R&D, Product Development, Process Engineering, Quality, and Operations teams, you will drive innovation and ensure robust, scalable, and cost-effective die bond solutions that meet future technology requirements.

What Will You Do

• Develop and qualify new die bond processes, materials, and assembly technologies.
• Lead process development activities for new semiconductor packages and products.
• Design and execute experiments (DOE) to optimize process performance and reliability.
• Evaluate and introduce new die bonding equipment, tools, and process capabilities.
• Support technology transfer from development to mass production.
• Conduct process characterization, capability studies, and reliability assessments.
• Perform root cause analysis for development-related process challenges.
• Collaborate with suppliers and equipment vendors on emerging technologies and process solutions.
• Generate technical documentation, process specifications, and qualification reports.
  
  
  

What will you need

• Bachelor's Degree in Electrical Engineering, Electronic Engineering, Mechatronics Engineering, Manufacturing Engineering, Materials Engineering, or a related field.
• 2-5 years of experience in semiconductor assembly, die attach/die bond process engineering, or advanced manufacturing.
• Fresh graduates with strong academic achievements and relevant industrial exposure may be considered for entry-level positions.
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.