Engineer Package Technology ( Contract )
Infineon Technologies
Date: 2 weeks ago
City: Malacca
Contract type: Full time
Perform design and drafting drawing and specification for package and lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
Your Role
Key responsibilities in your new role
Qualifications And Skills To Help You Succeed
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Your Role
Key responsibilities in your new role
- Use of AutoCAD and Inventor tool in package development cycle. Understanding design systematics, creating 3D models and parametric control.
- Use of CAD Desktop and SAP in Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop as well as Metadata, revisioning, file linkages, and derivations.
- Design method and design flow of new package and leadframe based on technical capabilities of materials, processes and suppliers.
- Modified 2D and 3D output.
- Drive Package / leadframe 3D design development activities and ensure fulfilment of project milestone deliverables and documentation release (spec, drawing, SAP)
- Liaise with leadframe engineer to ensure fulfilment of all leadframe specification and requirement.
Qualifications And Skills To Help You Succeed
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
- Preferably fresh graduate / Junior with in-depth AutoCAD 2D and AutoDESK Inventor 3D Skills Drafting / designing (2D/3D) Lead Frame using AutoCAD / Inventor.
- Drafting / designing (2D/3D) semiconductor package (Mold Body, Wire, Chip, Solder & etc) using AutoCAD / Inventor.
- GD&T knowledge / material specification definition.
- Strong mathematic knowledge (Algebra, trigonometry & etc) for Inventor parametric.
- Analytical and problem solving skills.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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