Engineer Unit Process Development Die Attach ( Contract )
Infineon Technologies
Date: 2 hours ago
City: Malacca
Contract type: Full time
Conduct die attach process development for new products, which includes optimizing parameters and validating processes.
Your Role
Key responsibilities in your new role
Qualifications And Skills To Help You Succeed
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Your Role
Key responsibilities in your new role
- Develop innovative processes and methodologies for process characterization for both existing and new technologies.
- Collaborate with manufacturing and equipment teams to ensure effective integration of processes.
- Support the assembly of prototype and development samples.
- Carry out risk assessments and identify technical challenges.
- Assist with the qualification and setup of equipment for new bonding technologies, such as Die Attach, Clip Bond, and Reflow Oven.
- Provide input for updating relevant documents and ensure their accuracy, including Process Specification, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, FMEA, OJTI/WI, T32, etc., for development projects.
Qualifications And Skills To Help You Succeed
- Bachelor's Degree in Engineering or relevant course with 1 year working experience in semiconductor manufacturing industry or others relevant industry.
- Fresh graduate welcome to apply.
- Strong hands-on knowledge and skills in FOL process/ Die Attach/Clip Bonder process is an advantage.
- Proficient in JMP, Minitab, or equivalent tools for DOE and statistical analysis.
- Team player with good communication, presentation skills and interpersonal skills.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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