Engineer Unit Process Development Die Attach ( Contract )

Conduct die attach process development for new products, which includes optimizing parameters and validating processes.

Your Role

Key responsibilities in your new role

• Develop innovative processes and methodologies for process characterization for both existing and new technologies.
• Collaborate with manufacturing and equipment teams to ensure effective integration of processes.
• Support the assembly of prototype and development samples.
• Carry out risk assessments and identify technical challenges.
• Assist with the qualification and setup of equipment for new bonding technologies, such as Die Attach, Clip Bond, and Reflow Oven.
• Provide input for updating relevant documents and ensure their accuracy, including Process Specification, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, FMEA, OJTI/WI, T32, etc., for development projects.
  
  

Your Profile

Qualifications And Skills To Help You Succeed

• Bachelor's Degree in Engineering or relevant course with 1 year working experience in semiconductor manufacturing industry or others relevant industry.
• Fresh graduate welcome to apply.
• Strong hands-on knowledge and skills in FOL process/ Die Attach/Clip Bonder process is an advantage.
• Proficient in JMP, Minitab, or equivalent tools for DOE and statistical analysis.
• Team player with good communication, presentation skills and interpersonal skills.
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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