Molding Technical Expert

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

The Mold Technical Expert will drive technology advancement for the molding process across our Back-End sites, covering both equipment and tooling technologies.

This role is expected to deliver significant improvements in Quality, Delivery, Productivity, Cost, and Competency by driving technical improvements, sharing best practices, and collaborating with engineering teams across multiple sites.

What You Will Do

• Be a member of the cross-site Back-End Engineering Team, responsible for the molding process and reporting to the Back-End Engineering Manager, Assembly.
• Introduce and drive breakthrough projects for the molding area by leveraging internal and external networks.
• Work closely with site Engineering teams to ensure effective cross-site execution of processes and applications.
• Share best practices across different sites and monitor their deployment.
• Drive OEE, quality, and productivity improvement initiatives in partnership with local sites and suppliers.
• Act as the equipment and tooling technical expert, partnering with Package R&D teams, Business Groups, and Procurement.
• Lead the Mold User Group and oversee equipment benchmarking across sites.
• Ensure the Package Roadmap is aligned with the existing equipment installed base and capability limitations.
• Travel to different sites when required.
  
  
  

What You Will Need

• Bachelor's or Master's degree in a technical discipline such as Mechanical, Electrical, Electronics Engineering, or equivalent.
• At least 8 years of working experience as an Equipment, Tooling, Process, or R&D Engineer specializing in molding within the semiconductor industry.
• Hands-on experience with various molding machines, such as ASM, Towa, Yamada, or similar equipment.
• Strong knowledge of mechanical, tooling, electrical, AOI, and mechatronics systems.
• Good knowledge of tooling materials and coatings.
• Experience in structured problem-solving methodologies and tools such as PDCA, 8D, DMAIC, QC Tools, and FMEA.
• Experience in writing and reviewing detailed equipment purchase specifications.
• Ability to prepare technical reports and deliver presentations.
• Experience in technical project leadership and project management.
• Experience working in a cross-cultural and multi-site environment.
• Six Sigma Green Belt or above certification is preferred.
• Good command of English, with professional verbal and written communication skills when working with internal stakeholders and suppliers.
• Self-motivated, with a reliable working style and timely delivery of reports and KPIs.
• Strong teamwork skills and ability to collaborate effectively across multiple locations.
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.