Package Development Senior Manager

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

This role is part of the Package Development team, responsible for leading backend assembly and package platform development, including defining and executing technology roadmaps aligned with business and product needs. The role drives development from concept to mass production, ensuring reliable, manufacturable, and cost-effective solutions.

It involves resolving technical challenges, driving cross-functional collaboration, and supporting continuous improvement and new technology development. The role also includes stakeholder management and coaching team members to build technical capability and support career growth.

What You Will Do

• Leads the strategic definition and execution of package platform and backend assembly technology roadmaps, ensuring alignment with business objectives and product innovation needs.
• Drives the development and qualification of assembly packaging solutions from concept to mass production.
• Support teams to achieve project goals by clearing technical roadblocks.
• Accountable for delivering reliable, manufacturable, and cost-effective package solutions, while influencing key technology decisions and enabling competitive advantage.
• Acting as a technical leader, the role ensures strong cross-functional collaboration, drives continuous improvement, and identifies future-ready assembly technologies to sustain long-term growth.
• Ensure good communication and stakeholder management.
• Coaching and develop team’s technical competence and career growth.
  
  
  

What You Will Need

• Bachelor’s Degree/Master in Engineering.
• At least 10 years of relevant experience in the semiconductor industry, with a minimum of 3 years in a managerial capacity.
• The incumbent is also expected to have comprehensive knowledge on assembly process, BOM, design and equipment technologies related to semiconductor packaging.
• Technical skill : Package design rule review, Thermal and stress FEA simulation , DFMEA, PFMEA , DFx (DFM, DFA, DFR) , AutoCAD, root cause analysis, DFPC, analytical tool
• Strong leadership , ability to coach others.
• Able to actively build up and broaden own competencies and contacts, share into the organization. Keeping up to date with state of the art packaging, material and process developments.
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.