Senior Equipment Engineer

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

As a Senior Equipment Engineer (Wire Bond), you will be responsible for sustaining, optimizing, and continuously improving Wire Bond manufacturing equipment to support production, quality, yield, and cost targets within a high-volume semiconductor manufacturing environment.

Key responsibilities include:

• Lead troubleshooting and root cause analysis of Wire Bond equipment issues to minimize downtime and maximize productivity.
• Drive equipment reliability, stability, and Overall Equipment Effectiveness (OEE) improvement initiatives.
• Develop and implement preventive and predictive maintenance programs for Wire Bond machines.
• Support new equipment installation, qualification, setup, buy-off, and commissioning activities.
• Partner closely with Production, Process Engineering, Quality, Manufacturing, and Maintenance teams to resolve equipment-related challenges.
• Analyze equipment performance data and implement corrective actions to improve machine efficiency and product quality.
• Drive continuous improvement and cost reduction projects to enhance manufacturing performance.
• Ensure compliance with safety, quality, and environmental requirements.
• Provide technical guidance and coaching to junior engineers and technicians.
• Support automation, digitalization, and Industry 4.0 initiatives related to Wire Bond operations.
  
  
  

This is you:

Education & Experience

• Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, or related Engineering disciplines.
• Minimum 3-5 years of experience in Semiconductor Manufacturing, with hands-on experience supporting Wire Bond equipment.
• Experience in semiconductor assembly and packaging environment is highly preferred.
  
  
  

Must-Have Technical Skills

• Strong hands-on experience in Wire Bond equipment maintenance, troubleshooting, and process support.
• Knowledge of Wire Bond processes, machine parameters, and equipment optimization.
• Experience in equipment reliability improvement and preventive maintenance programs.
• Proficient in Root Cause Analysis tools such as 8D, 5 Why, Fishbone Diagram, and FMEA.
• Experience in OEE improvement, yield enhancement, and continuous improvement projects.
  
  
  

Nice-to-Have Technical Skills

• Experience with leading Wire Bond equipment platforms (ASM, K&S, Hesse or equivalent).
• Knowledge of automation, robotics, and smart manufacturing solutions.
• Lean Six Sigma Green Belt or equivalent certification.
• Experience in new equipment qualification and technology transfer projects.
  
  
  

Must-Have Soft Skills

• Strong analytical and problem-solving skills.
• Effective communication and stakeholder management abilities.
• Ability to work independently in a fast-paced manufacturing environment.
• Strong sense of ownership and accountability.
  
  
  

Nice-to-Have Soft Skills

• Leadership and mentoring experience.
• Project management capabilities.
• Continuous improvement mindset and adaptability to change.
  
  
  

This is your department and colleagues:

You will be part of the Equipment Engineering team supporting Semiconductor Assembly Manufacturing operations. The team works closely with Production, Process Engineering, Quality Engineering, Manufacturing Excellence, and Maintenance teams to ensure stable manufacturing performance and successful delivery of operational targets.

This is what Nexperia offers:

Join a global semiconductor company where your expertise in Wire Bond equipment engineering will directly contribute to delivering high-quality semiconductor products used worldwide. You will be exposed to advanced manufacturing technologies, challenging engineering projects, and continuous development opportunities.

We offer:

• Exposure to advanced semiconductor assembly and packaging technologies.
• Opportunities to lead continuous improvement and equipment optimization initiatives.
• Career growth and professional development programs.
• Collaborative and diverse international working environment.
• Competitive compensation and comprehensive employee benefits.
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.