Senior Staff Engineer Technology Integration

Join our Technology Integration team and play a critical role in enabling the successful development and industrialization of advanced semiconductor package technologies. As a Senior Staff Engineer, you will be responsible for driving technology integration activities across package platforms, identifying and mitigating process interaction risks, and ensuring seamless integration between Front-End (FE) and Back-End (BE) technologies. You will work closely with cross-functional engineering teams to conduct risk assessments, lead technical problem-solving initiatives, and support the development of innovative semiconductor packaging solutions.

Your role

Key responsibilities in your new role

• Lead Package Business Case (PBC) and Technology Project Case (TPC) assessments by evaluating technical feasibility, risks, and integration readiness of new package technologies.
• Drive Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities to identify, assess, and mitigate technical risks throughout the product development lifecycle.
• Own risk interaction assessments and mitigation work packages, ensuring systematic identification and resolution of integration challenges across technologies and processes.
• Lead the integration of unit processes, Bill of Materials (BOM), and process flows within package platforms while assessing interdependencies, compatibility, and manufacturing risks.
• Act as the key technical interface for Front-End (FE) and Back-End (BE) interaction topics, ensuring alignment and successful technology integration across development and manufacturing organizations.
• Support pre-development activities for new chip technologies through early risk assessments, technology evaluations, and integration studies.
• Lead or actively contribute to structured problem-solving activities, including 8D investigations, root cause analysis, and corrective actions for inter-process interaction issues.
• Assess the impact of package and design rules on process interactions, manufacturability, reliability, and overall technology performance.
• Provide technical guidance, coaching, and consultation to project teams on technology integration, interaction risks, and package development challenges.
• Collaborate with cross-functional stakeholders across Package Development, Process Engineering, Manufacturing, Quality, Reliability, and Product Development to ensure successful project execution.
  
  

Your profile

Qualifications And Skills To Help You Succeed

• Bachelor's Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation Engineering, Mechanical Engineering, Electrical Engineering, Electronics Engineering, Physics, or a related discipline.
• Minimum 10 years of experience in the semiconductor industry with strong exposure to semiconductor package development, technology integration, assembly, and test processes.
• Solid understanding of semiconductor packaging technologies, assembly processes, test operations, and package platform development.
• Strong knowledge of Front-End (FE) to Back-End (BE) interactions, as well as Back-End to Back-End process integration and technology interactions.
• Proven experience leading technical risk assessments, DFMEA activities, integration studies, and engineering problem-solving initiatives.
• Strong analytical, troubleshooting, and decision-making skills with the ability to evaluate complex technical interactions and drive effective solutions.
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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