Senior Staff Engineer Unit Process Development Die Attach

Join our Unit Process Development team as a Senior Staff Engineer specializing in Die Attach technology. In this role, you will be responsible for driving the development, optimization, qualification, and industrialization of die attach processes for advanced semiconductor packages. You will lead process innovation initiatives, solve complex technical challenges, and collaborate closely with cross-functional teams, suppliers, and manufacturing sites to ensure robust, cost-effective, and manufacturable process solutions. As a technical expert, you will play a key role in shaping future process technologies and supporting new product development programs.

Your role

Key responsibilities in your new role

• Lead process development activities for Die Attach technologies, including process parameter scouting, optimization, verification, qualification, and process freeze to meet project objectives in quality, cost, manufacturability, and timeline.
• Drive technical handover and knowledge transfer activities from development to manufacturing operations, ensuring successful process implementation and production readiness.
• Support prototype builds, engineering samples, and development projects while ensuring process stability and technical compliance throughout the development cycle.
• Develop, maintain, and review technical documentation including Process Specifications, PFMEA, DFMEA, OJTI, T32, PDR, and other engineering records.
• Provide technical ownership and input for Process of Record (POR), Assembly Design Rules, Process Roadmaps, Control Plans, Failure Catalogues, and Maintenance Checklists.
• Collaborate with equipment, tooling, and material suppliers to evaluate, verify, qualify, and implement new technologies, machines, tooling solutions, and materials.
• Lead task forces and multidisciplinary teams in resolving complex manufacturing and process-related challenges using structured problem-solving methodologies and statistical tools.
• Identify and develop next-generation Die Attach process technologies and continuously improve process capability to support future business and product requirements.
• Support technology selection and definition activities involving materials, equipment platforms, tooling concepts, and process architectures.
• Provide technical coaching, mentorship, and guidance to engineers, project teams, and stakeholders on Die Attach process technologies and best practices.
  
  

Your profile

Qualifications And Skills To Help You Succeed

• Master's or Bachelor's Degree in Engineering, Materials Science, Chemical Engineering, Semiconductor Technology, Microelectronics, Mechanical Engineering, Electrical Engineering, or a related technical discipline.
• Minimum 8 years of experience in the semiconductor manufacturing industry, with strong exposure to assembly process development and semiconductor packaging technologies.
• Strong hands-on knowledge and expertise in semiconductor assembly processes, particularly Die Attach technologies, materials, equipment, and process integration.
• Solid understanding of material science principles, chemical interactions, and process-material relationships within semiconductor manufacturing environments.
• Strong analytical and problem-solving skills with the ability to diagnose complex process issues and drive effective corrective and preventive solutions.
• Experience with statistical analysis and data-driven decision-making, including Design of Experiments (DOE), process characterization, and process optimization methodologies.
  
  

#WeAreIn for driving decarbonization and digitalization.

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