Sr Wirebond Process Development Engineer

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

As a Sr Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.

What You Will Do

• Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma
• Drive end-to-end process development from concept to stable, high-yield manufacturing solutions
• Provide technical input for assembly processes and equipment solutions for new products and platforms
• Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites
• Apply wafer metallization knowledge to optimize process performance and stability
• Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives
• Use statistical analysis tools (e.g. Minitab/Statistica) to analyze process performance and drive data-based decisions
• Provide technical support for wire bond-related issues for both internal and external customers
• Demonstrate technical leadership in cross-site problem solving and process improvement activities
• Communicate effectively across teams, ensuring clear technical alignment and fast response to manufacturing challenges
  
  
  

What You Will Need

• Bachelor’s degree in engineering or an equivalent related field of study
• At least 5 years of experience in semiconductor or manufacturing environment
• Hands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI)
• Strong knowledge of wire bond packaging technologies
• Experience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D, Minitab/Statistica)
• Strong analytical, problem-solving, and data interpretation skills
• Good communication skills in fluent English
• Strong teamwork, interpersonal skills, and ability to work across functions and sites
• Strong ownership, responsiveness, and ability to handle customer or production issues effectively
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.