Al Wire Bonding Process Development Engineer

Job Description

Job Summary:

Power module assembly process (Al Wire Bonding) Development.

• Technical Leadership on process technology development.
• Technical Leadership on responsible processes between PIDC and Manufacturing.
• Establish process POR through set up, feasibility and characterization followed by package development procedure.
  
  

Responsibilities

• Al wire bonding process development and enabling technology for transfer molded power module.
• Capable to understand power module design and proposal for improvement from Al wire bonding process.
• Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
• Familiar with Al wire materials.
• Capability to define KPIV from failures modes.
• Capability to define KPOV and generate output by analyzing process capability.
• Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
• Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc).
• Technical Leadership on Al wire bonding process.
• Capable to initiate new process and equipment working with technical leader and supplier.
• Responsible for P.O spec generation and buy-off.
• Capable to create COO for new process and equipment.
• Capable for benchmarking on the new and better process/equipment which are not not exist in company.
• Capability to create process technology roadmap, especially for Al wire bonding.
• Capability to generate new design rule based on characterization, working with technical leader and designer.
• Capable to understand customer requirements, application and EHS.
• Capable to find systematic solution and improvement planning for process defects.
• Supporting quality issue during production, effectively working with manufacturing team.
• COE Line Equipment Maintenance and Management.
• Capable for Al wire bonding equipment and tooling set-up (on-hand skills).
• Responsible for tooling and jig design, working with designer and suppliers for new tooling/jig design.
• Responsible for equipment/tooling/jig readiness on time.
• Leading Al wire bonding technician/operators to do the right job.
• Sharing process technical issue, result and improvement plan to technical leader.
  
  

Qualifications

Requirements:

• Experienced year : Min.10 years.
• Experienced areas : Al wire bonding (Al wedge, Au/Cu ball bonding), design career or equipment engineering carrier is plus.
• Experienced packages : Transfer molded power module (Intelligent Power Module, Dual Side Cooling Module, Power Discretes)
• Nationality : Local preferred.
• Education : BS or MS degree.
• Skills : Fluent with English communication, familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation).
• Personal characteristics : self-motivated, independent, open mind to communicate, willing to take risk and managing.
  
  

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.