Assy Backend Process Engineer

NXP Semiconductors


Date: 2 weeks ago
City: Kuala Lumpur
Contract type: Full time
Job Summary

The job incumbent is responsible for the Backend Ball Attach Process and will focus on the troubleshooting of both quality and process problems in the relevant field by maintaining the Standard Operating Procedures (SOP) and guidelines describing essential functions or practices. Ensure successful manufacturing production runs by assessing risks (Material such as solder ball, substrate and machine stability), setting preventative measures. At the same time focus on the New Product Introduction by creating new process flow.

Key Accountabilities

  • To Lead off assigned processes / module.
  • To participate, conduct & optimize improvement that related to quality, yield, productivity, delivery and cost.
  • To involve in commissioning new machines, monitoring modifications, upgrades and troubleshooting existing processes.
  • To ensuring that all aspects of related process comply with control regulation's standard.
  • To liaise with vendor / supplier & ensure all related items (machine, materials…etc) are complies with updated specification.
  • To create, process control standard, process standard, Standard Work Instruction, establish engineering Operation Manual Operation Instruction & ensure all engineering related documents are up to date.
  • To liaise & support for New Product Introduction (NPI) related activities from prototype to High Volume Manufacturing (HVM) stage.
  • To comply and support for all department and corporate policies and procedures such as quality, safety and environmental policy.
  • To provide process related guide line and participate in, Material Disposition Review (MDR). Planning and implement for New Structure Development of existing and new product Control customer documents and technical information. Promote of 5S and safety activities.

Requirements

  • Bachelor/Master degree in engineering field.
  • Problem solving and analytical ability
  • Understanding of engineering drawings and manufacturing processes
  • Understand the functionality of JMP,FMEA, RC Analysis, SWOT Analysis and DMAIC
  • A keen learner, self-motivated and possess good teamwork spirit.
  • Work independently with minimal supervision .
  • Good communication, ability to present data effectively, analyze and problem solving skills

More information about NXP in Malaysia...

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