Engineer Package Technology
Infineon Technologies
Date: 5 days ago
City: Malacca
Contract type: Full time
In your new role you will:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
- Examine new package concepts by considering alternatives and leverage synergies to other package development sites
- Be the go-to person for many backend relevant issues; therefore, you collaborate closely with Application Engineering, Marketing, Product Development and Quality Management at our European, American and Asian sites
- Support innovative ideas in power electronic packaging; therefore, you keep up to date of relevant trends regarding packaging
- Support feasibility studies: prototype building according to application requirements
- Uses existing procedures to solve routine or standard problems
- Actively support problem solving processes in the area of chip/package interplay
- You are open to new ideas and receptive to other ways of thinking or working. Furthermore, you remain focused on solutions, open, and flexible even when under pressure. Lastly, you are able to quickly establish a successful cooperation.
- A degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
- First relevant work experience with focus on packaging of semiconductor products
- Good understanding of basic semiconductor packaging, assembly and test.
- Experience with CAD would be a big plus (AutoCAD/Inventor)
- First exposure to PCB design will be valuable
- A good team player and able to communicate effectively in cross functional teams and with intercultural counterparts
- Fluent English skills in verbal and written communication
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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