Engineer Package Technology Development
Infineon Technologies
Date: 6 hours ago
City: Malacca
Contract type: Full time
Use of AutoCAD and Inventor tool in package development cycle. Understanding design systematics, creating 3D models and parametric control.
Job Description
In your new role you will:
You are best equipped for this task if you have:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Job Description
In your new role you will:
- Use of CAD Desktop and SAP in Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop as well as Metadata, revisioning, file linkages, and derivations.
- Design method and design flow of new package and lead frame based on technical capabilities of materials, processes and suppliers.
- Modified 2D and 3D output.
- Drive Package / leadframe 3D design development activities and ensure fulfilment of project milestone deliverables and documentation release (spec, drawing, SAP, etc)
- Liaise with leadframe engineer to ensure fulfilment of all leadframe specification and requirement.
- Participate in the formulation of internal design standards and specifications, design experience accumulation and sharing, and other team suggestions.
You are best equipped for this task if you have:
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
- Preferably fresh graduate / Junior with in-depth AutoCAD 2D and AutoDESK Inventor 3D Skills.
- Drafting / desigining (2D/3D) Lead Frame using AutoCAD / Inventor.
- Drafting / desigining (2D/3D) semiconductor package (Mold Body, Wire, Chip, Solder & etc) using AutoCAD / Inventor.
- GD&T knowledge / material specification definition.
- Strong mathematic knowledge (Algebra, trigonometry & etc) for Inventor parametric.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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