ENGR PRIN, PACKAGE DEVELOPMENT

Key Responsibilities

JOB DESCRIPTION

• This job requires a full-time senior engineer with strong engineering knowledge and skills in mold and trim and form equipment and process for early engagement in package development and qualification for a robust HVM.
• Analyze and implement efficient, cost effective and innovative methodologies to improve assembly processes.
• Good knowledge in Six Sigma methodology and the DMAIC approach.
• Experienced in running the Design of Experiment (DOE) and analyzing data using JMP software.
• Practice good quality system and production control.
• Good teamwork and leadership.
  
  

Knowledge, Skills And Abilities

• Must be statistically sound and familiar in running DOE, perform characterization and optimization studies independently. Familiar with JMP/ minitab software is an advantage.
• Proficient in Malay and English.
  
  

Qualifications

QUALIFICATION AND EXPERIENCE

• Minimum Bachelor's Degree in Electronic, Electrical, Mechanical, material Engineering or equivalent.
• Minimum of 7 years work experience as a mold/ trim and form engineer preferred.
  
  

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.