Lead Principal Engineer Package Technology
Infineon Technologies
Date: 3 weeks ago
City: Malacca
Contract type: Full time
Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact.
Job Description
In your new role you will:
You are best equipped for this task if you have:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Job Description
In your new role you will:
- Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
- Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
- Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
- Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
- Support pre development & project definition stage, and continue to be package design expert throughout project phase.
- Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
You are best equipped for this task if you have:
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
- 10 years of relevant working experience in IC/semiconductor environment.
- Semiconductor Packaging, Assembly and Test.
- Process and Equipment Engineering knowledge.
- Failure Analysis and Reliability Engineering.
- Analytical and Problem Solving Skills.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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