Principal Engineer Package Design Development

We are seeking an experienced Principal Engineer Package Design Development to lead packages design and development for automotive products. This role provides technical leadership across cross-functional teams, drives design innovation and supports product development.

Your Role

Key responsibilities in your new role

• Package Design and Development: Design and develop Flip chip BGA and Wirebond BGA Package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
• Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
• Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
• Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned.
• Project Management: Collaborate closely with subcon partners to identify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope.
  
  

Your Profile

Qualifications And Skills To Help You Succeed

• Min. Bachelor / Master’s degree in Material Science, Mechanical, Electrical, Chemical Engineering / Physics or equivalents
• Min. 10 years of experience in package development, process development (assembly), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects for automotive products.
• Good technical knowledge of Back End processes & material knowledge in bumping and laminate packages and interaction with the different functions (e.g. design rules, direct materials and processes qualification).
• Good understanding of Automotive quality / reliability requirements and standards.
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

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