Principal Engineer Package Technology

To define and develop the right package for new products/technologies from BU/FE, from concept, feasibility study, and realization.

Job Description

In your new role you will:

• Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new packages, risks and impact.
• Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
• Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
• Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3)
• Ne the contact partner and technical consultant for package definition to the Business Division especially on BE assembly technology know how.
• Support the pre-development & project definition stage, and be a package design expert throughout the project phase.
• Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
• Consolidate the inputs for ADR and ensure the contents are updated (A project).
• Be the main contact person and technical consultant/coach for all questions and discussions regarding packaging, package design and Package.
• Drive innovation and pre-development activities within the package platform.
  
  

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• At least 9 years of relevant working experience in IC/semiconductor environment.
• Experience in Semiconductor Packaging, Assembly and Test.
• Process and Equipment Engineering knowledge.
• Analytical and Problem Solving Skills.
• AutoCAD and 3D drafting are preferred.
  
  

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