Principal Engineer Package Technology

Drive Technology Integration activities to ensure the package fulfil the requirements in the aspect of Process Interactions.

Job Description

In your new role you will:

• Execute PBC and TPC assessment within A-project development.
• Driver of Package Technology DFMEA for A-project.
• Owner of Risk Interaction assessment and mitigation work packages.
• Responsible for the integration of unit processes (BOM and Process) in package platform - Risk assessment, study interactions with other processes and process flow.
• Key working partner for FE in FE/BE for new FE technology, process interaction and integration topics.
• Support Pre development for new Chip technology / new package development within development platform.
  
  

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics).
• 8 years of relevant working experience in IC/semiconductor environment.
• Experience in Semiconductor Packaging, Assembly and Test.
• Excellent technical knowledge of BE processes and materials in plastic packages and interaction to the different functions (interaction between FE-BE / BE-BE processes).
• Excellent technical knowledge of Process and Equipment Engineering.
• Good knowledge on the internal package analysis and first level reliability.
  
  

#WeAreIn for driving decarbonization and digitalization.

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