R&D Manager

Lead the Strategic Technical Direction and manage the Technology Center for Research & Development (R&D). Provide leadership in developing and implementing strategies for R&D, including modeling, simulation, and managing the R&D Pilot Line.

Key Responsibilities:

• Lead strategic initiatives to develop and commercialize innovative technologies and align with corporate roadmaps.
• Establish and strengthen critical internal capabilities to drive value engineering, cost reduction, and problem-solving.
• Ensure Carsem’s technology remains competitive by recommending and guiding Carsem Technology Center Programs.
• Build and enhance the infrastructure needed to meet strategic development goals.
• Manage patent processes for Carsem's M-site and S-site to protect intellectual property.
• Interface with customers for new products, materials, and process development, focusing on speed, cost-effectiveness, and seamless manufacturing.
• Oversee multiple product design teams to enable quick time-to-market at optimal costs.
• Lead packaging solutions and provide in-depth customer presentations on technology.
• Collaborate with design and production teams to assess and provide essential product design, assembly, and testing information.
• Ensure the technical aspects of the company’s strategy align with its business goals.
• Advise management on new developments that may impact profitability, schedules, costs, or customer relationships.
• Stay informed on new technologies that could improve operations and products and present recommendations.
• Develop and enhance products for key market segments, driving growth into new markets.
• Manage the R&D pilot line, ensuring efficiency and continuous improvement.
• Any additional tasks assigned by management.

Job Requirements:

Education & Experience:

• Bachelor’s Degree in Computer Science, Software Engineering, Electrical & Electronic Engineering, Physics, or equivalent.
• Minimum of 10-15 years of experience in the semiconductor industry.

Technical Knowledge & skills:

• Expertise in Assembly and Testing processes.
• Strong understanding of IC packaging and materials.
• Proficient in Project Management, from new product introduction to mass production.
• Knowledge of lean manufacturing and manufacturing operations.
• Business planning and budget management skills.
• Strong interpersonal skills, capable of building and maintaining positive relationships with peers, customers, and stakeholders.
• Excellent project management and cross-functional leadership skills.
• Assertive, proactive, and a team player.