RF Assembly Process Engineer

NXP Semiconductors


Date: 2 weeks ago
City: Kuala Lumpur
Contract type: Full time
Roles and Responsibilities

  • Responsible for Quality, Yield, Cost and Productivity improvement activities related to Wire bond process in RF Assembly
  • Partner with manufacturing and equipment team to support delivery, work on daily production line issues, drive quality and operational excellence
  • Responsible for process yield improvements and LOH reduction through systemic problem solving and identifying solutions to baseline issues
  • Partner with supplier, vendor, procurement to work on productivity and cost improvement projects for the operation.
  • Support NTI/NPI qualification, apply lesson learnt and ensure smooth transition to high-volume manufacturing. Collaborate with API
  • Responsible for FMEA, Control Plan, OCAP and SWE as documentation owner and to drive enhancement and compliance
  • Work on strategic industrialization plan, automation and quality firewall implementation
  • Collaborate with cross functional team to improve manufacturing robustness and process stability
  • Support internal and external audit, drive compliance to requirements

Profile

  • Bachelor’s Degree in Engineering Discipline (Material Science/Electrical/Mechanical or equivalent)
  • Good knowledge in material science especially metallurgy
  • Technically competent, data driven and hands-on with strong analytical thinking and good in problem solving
  • Has the desire to learn, take up new challenges, consistently challenge status quo and eager to strive for success
  • Strong interpersonal skills, a good team player with ability to work independently and resourceful
  • Able to multi-tasks, work under pressure and tight dateline and comfortable working in a fast-paced environment

More information about NXP in Malaysia...

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