Senior Engineer(Wirebond Process Development)

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

Job Description

About the role

The Senior Engineer (Wirebond Process Development) is responsible for the design, development, optimisation, and industrialisation of wire bonding processes for advanced semiconductor packaging. This role supports New Product Introductions (NPI), technology roadmap projects, and continuous process improvement in high-volume manufacturing (HVM). The engineer ensures process robustness, high yield, and scalability while working with cross-functional teams, including R&D, equipment engineering, quality, and operations.

What You Will Do

• Process Development & NPI Enablement
• Develop and qualify new wire bonding processes (ball/wedge bonding, Cu/Ag/Au wires) for leadframe, TSSOP, VSSOP, DHVQFN, and advanced packaging platforms.
• Define optimal bonding parameters, including bonding force, ultrasonic power, time, temperature, and capillary design.
• Support process characterisation, material compatibility studies, and engineering build reviews for NPI.
• Technology Roadmap & Advanced Materials
• Evaluate and implement advanced bonding technologies such as fine pitch bonding, low-looping, stitch-on-ball (SoB), dual bonding, or hybrid bonding.
• Work with wire vendors (Tanaka, Heraeus, AP&C) to evaluate and qualify new wire types (e.g., Pd-coated Cu, Ag alloy) for reliability and performance.
• Lead investigations into new capillaries, bonding tools, and surface finishes to improve bondability and reliability.
• Yield Improvement & Defect Reduction
• Analyse bonding defects (e.g., non-stick-on-pad (NSOP), heel crack, wire sweep, ball-off, stitch lift, etc.) using structured problem-solving tools (8D, DMAIC).
• Drive yield enhancement projects by optimising parameters, improving materials, and refining process windows.
• Perform DOE and data analysis to identify critical parameters and interactions affecting quality and throughput.
• Equipment Integration & Automation
• Collaborate with equipment vendors (K&S, ASM, Hesse Mechatronics, Shinkawa) to implement new features, software updates, or process controls.
• Lead equipment evaluation, buy-off, and qualification for new wire bonders or tooling in support of capacity expansion and technology upgrades.
• Support transition from lab to HVM, ensuring process stability, reproducibility, and operator readiness.
• Cross-functional Collaboration
• Work closely with product engineering, quality, layout design, and reliability teams during new product development and ramp-up.
• Interface with global R&D, package development, and customer engineering teams for design reviews and technical discussions.
• Participate in technical audits, customer visits, and troubleshooting sessions as a wire bonding subject matter expert (SME).
• Documentation & Process Control
• Create and maintain technical documentation: Process Specs, Control Plans, PFMEA, WI/SOP, parameter sheets.
• Define critical process control points, implement Statistical Process Control (SPC), and lead continuous improvement initiatives (Kaizen, Lean).
  
  
  

What You Will Need

• Bachelor’s or Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
• Minimum 5 years in semiconductor wire bonding process development or engineering.
• Proven experience in Cu/Ag/Au wire bonding, fine-pitch or high-pin-count bonding, and new product qualifications.
• Strong understanding of bonding theory, metallurgy, and wire-material-substrate interactions.
• Skilled in equipment troubleshooting, bonding profile tuning, and defect analysis.
• Proficient in JMP, Minitab, or equivalent tools for DOE and statistical analysis.
• Excellent project management, communication, and cross-functional leadership skills.
• Familiar with automotive, JEDEC, and AEC-Q100 reliability standards for bonding.
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.