Senior Equipment Engineer (Trim and Form)

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

About The Role

This role leads the maintenance and continuous improvement of trim and form equipment across multiple package types to ensure high performance and reliability in manufacturing. You will oversee equipment downtime management, process validation, and technical documentation, while partnering with cross-functional teams in engineering, R&D, and production.

What you will do:

• Lead the maintenance and continuous improvement of trim and form equipment across diverse package types.
• Equipment down-time (DT) monitoring and mitigation planning (MTBF/MTBA), regularly assess the effectiveness of scheduled DT activities, ensuring verification and buy-off processes meet equipment specifications and performance standards.
• Partner with the process engineering team to validate new product designs during development and qualification phases for high-volume manufacturing (HVM).
• Collaborate with cross-functional teams to maintain and update technical documentation such as control plans, process specifications, SOPs, technical reports, and FMEAs.
• Plan technician headcount coverage to support 24/7 operations, delegate tasks effectively, and provide consistent transparency updates.
• Mentor and coach technicians to strengthen engineering competencies and mindset, including setting KPIs and conducting annual performance reviews.
• Collaborates with R&D, NPI, product design, and reliability teams to align molding equipment capabilities with package architecture and process requirements.
• Diagnose and resolve trim and form related defects.
• Facilitate seamless technology, process, and equipment transfers and ramp-ups to HVM.
• Contribute to the development of process technology roadmaps for advanced packaging, thin form factors, and emerging device architectures.
• Actively participate in improvement initiatives such as MVA, yield enhancement, and UPH optimization.
• Manage spare parts inventory and procurement activities.
• Liaise with suppliers and vendors for jig and fixture orders and closely monitor delivery timelines for both spare and non-spare items.
• Thrive in a dynamic, fast-paced manufacturing environment.
  
  
  

What you will need:

• Bachelor’s degree in any engineering discipline.
• Minimum 5 years of experience in the semiconductor industry, with at least 3 years in trim and form and tooling details.
• Proven hands-on expertise in trim and form machines for semiconductor packaging.
• Proficient in statistical analysis tools such as JMP and Minitab, and skilled in technical documentation.
• Deep understanding of the tooling, material properties and behavior, GD&T, tolerances, and metrology equipment’s will be added advantage.
  
  
  

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.