Senior Manager OSAT

Company Overview:

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 70 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

MACOM is an Equal Opportunity Employer.

We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status.

Job Description and Responsibilities:

As part of the Off-Shore Assembly team, the candidate shall be able to:

• Manage Assembly Engineering teams and activities with OSATs to enable production revenue requirements
• Manage, sustain, and improve assembly yields by defining assembly processes
• Manage NPI engineering activities for new devices
• Provide supplier benchmarking and tracking data to drive backend technology roadmap
• Drive back-end process development for improved reliability, DFM, DFT, and short cycle-time with effective in-line controls and SPC
• Working with other teams, establish and verify the reliability testing requirements for new package designs and processes to guarantee reliable products
  
  

Job Requirements:

• BS in Materials Science, Chemical, EE or ME plus 15+ years of experience with advanced IC package assembly/test process development and design
• Experience leading Package/Assembly/Test engineering teams in a manufacturing environment with the objective of minimizing cost while improving productivity.
• Experience in reliability, failure analysis, and quality assurance in advanced package process development, effects of mechanical, environmental, and thermal stress, debug, and qualifications
• Experience in deep sub-micron and mixed signal IC packaging process and product development including SPC, DOE, FMEA and Failure Analysis.
• Intimate knowledge of first and second level interconnect design and reliability including fine pitch wire bonding, flipchip on organic and cermic substrates, and molding
• Demonstrated ability to lead independent process development and provide suppliers direction by working with design and quality organizations
• Experience in the semiconductor assembly Quality and Reliability with critical thinking and presentation skills.
• Experience in supplier management and proven Program Management skills.
• Proven expertise in directing mixed volume manufacturing operations around the globe with ability to establish and maintain strategic partnerships with foundries and assembly partners.
• Desire knowledge using: AutoCad, Data visualization tools, and AI tools
• Strong problem solving skills along with good communication, team work, and interpersonal skills