Senior Staff Engineer Leadframe/Substrate Designer

In your new role you will:

• Be the technical expert for leadframe/substrates/packing material in package development projects.
• Perform design, drawing and specification for leadframe/substrates based on design guidelines, assembly rules and ensure design for manufacturing, quality and cost.
• Collaborate with internal and material suppliers on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.
• Drive leadframe/substrates/packing material development activities and ensure fulfillment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc).
• Liaise with SQM and supplier to ensure fulfillment of quality requirement/FAI for leadframe/substrates/packing material; and qualification release.
• Establish design guidelines/requirements for leadframe/substrates/ packing material specification.
• Generate technical papers/journals and patents related to leadframe/substrates design/package design that enhances technical value.
• Provide support in incoming material quality, work with suppliers /internal to resolve technology/quality issues, improvement programs, etc.
• Involve in leadframe/packing material technology road mapping, UPEG activity and material selection to meet roadmap requirements.
• Actively engages with leadframe/substrates/packing material suppliers to explore new technology and best-in-cost design to achieve competitive advantages.
  
  

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, ElectronicsPhysics).
• 3-5 years of working experience in semiconductor assembly and packaging development; and relevant experience in Lead Frame /Substrates / Packing Material is preferred.
• Knowledge in leadframe/substrate design/packing material development & qualification.
• Drafting/designing (2D/3D) leadframe/substrate using AutoCAD/Inventor/Cadence.
• Knowledge in material physics/properties for leadframe/substrates and packing material.
• GD&T knowledge/material specification definition.
• Analytical and problem-solving skills.
• Basic semiconductor packaging, assembly and test.
• Knowledge in material development, analysis, qualification and reliability.
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.