Senior Staff Engineer Process Development (Molding)
Infineon Technologies
Date: 23 hours ago
City: Malacca
Contract type: Full time
Will be responsible to deliver the long term encapsulation roadmap mainly focusing on encapsulation equipment and for overall IFX backend manufacturing with the inputs from package platform roadmap.
Job Description
In your new role you will:
You are best equipped for this task if you have:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Job Description
In your new role you will:
- Continuous exploring on new encapsulation equipment development collaboration and technical discussion with key encapsulation equipment suppliers.
- Basic unit process equipment operation, function, mechanism and ability to define critical setup and conversion.
- Basic Risk Hazardous Analysis of semiconductor packaging requirement & manufacturing safe operation environment (example ESD & Ergonomics).
- Fundamental statistical data analysis & Statistical Process Control (example SPC).
You are best equipped for this task if you have:
- Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical /Electronics / Microelectronics / Mechatronics / Semiconductor Technology).
- 8 years working experience in semiconductor manufacturing industry ( Process Engineering, Manufacturing Engineering and Package Concept / Process Development Engineering.
- 2 years technical / functional experience in mainly in molding process (Process Engineering , Manufacturing engineering ,Package Development , Process Integration , Technology Integration) will be added advantage.
- Fundamental analytical and problem solving skills. (example 8DMethodology, DMAIC, 5-Why Analysis).
- Fundamental experience in statistical analysis tools (example JMP, MINITAB, CEDA, DX8).
- Fundamental understanding of mold process and packaging material interaction.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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