Senior Staff Engineer Robustness and Qualification Methodology

We are seeking an experienced Automotive Package Development Engineer to support and review package development projects in alignment with automotive development goals. This role involves method and process development, collaborating closely with package development teams and OSAT (Outsourced Semiconductor Assembly and Test) teams. You will be responsible for providing expert support on the robustness and reliability of packages and products, ensuring that automotive development objectives are met efficiently and effectively.

Job Description

In your new role you will:

• Support Package Development Projects: Provide technical support and review package development projects to ensure alignment with automotive development goals.
• Method/Process Development: Develop and implement methods and processes for automotive package development in close collaboration with package development and OSAT teams. Ensure that processes meet automotive-specific requirements and standards.
• Training and Knowledge Sharing: Design and deliver training materials (e.g., slide decks, videos) to support automotive development goals. Provide training on key concepts related to packaging and automotive development for internal teams.
• Robustness and Reliability Expertise: Offer expert support on the robustness, reliability, and performance of packages and products. Ensure all developments align with industry reliability standards and automotive requirements.
• Cross-Functional Collaboration: Work closely with various teams, including internal customers, to gather insights and support problem-solving initiatives.
• Problem-Solving & Analysis: Support and lead problem-solving activities by generating analyses, forming hypotheses, and drawing conclusions based on data. Use these conclusions to derive lessons learned and improve future development processes.
• FMEA and 8D Methodology: Apply FMEA (Failure Mode and Effects Analysis) and 8D (Eight Disciplines) methodologies to evaluate and mitigate risks in the packaging process.
  
  

Your Profile

You are best equipped for this task if you have:

• University Degree in Electrical Engineering or a related field.
• Expertise in Assembly Processes: Extensive experience in semiconductor assembly processes with a strong understanding of wafer production and technology.
• Unit Process Development/Engineering Experience: Proven experience in unit process development and package definition, with experience in more than one area preferred.
• Strong Communication Skills: Exceptional ability to listen to internal customers, understand their needs, and communicate technical information effectively. Able to see the big picture and maintain a service-oriented mindset.
• Problem-Solving Capabilities: Strong analytical skills to support problem-solving efforts, generate hypotheses, analyze data, and derive actionable insights. Ability to apply lessons learned to improve future development processes.
• Familiarity with Methodologies: Knowledge of FMEA and 8D methodologies is essential for evaluating and improving product quality and process efficiency.
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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