Senior Staff Specialist Package Technology Development

In your new role you will:

• Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target.
• Responsible for package definition tasks in the OSAT segment in defining project complexity definition with Delta assessment list, project category assessment and performing project risk assessment with mitigation actions.
• Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specifications, marking instructions and packing specifications for upload into the Database.
• Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes the OSAT technical capability assessment role.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development.
• Responsible for enabling new package platforms and derivativespackages, and support of technology and package development at OSAT.This includes a new subcon enabling support role.
• Be the driver or co-driver for platform-related Task force activities.
  
  

You are best equipped for this task if you have:

• Master or Bachelor degree in Engineering disciplines.
• Minimum 7 years’ working experience in package development in New introduction or process (Pre-assembly, assembly and test) and 3 years in supporting project management
• Experience in Module assembly, Wafer level package (WLP), bumping,eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of process and material in both laminates andleadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process).
• Good understanding of quality requirements / release criteria (e.gJEDEC/AEC grade) that fits and match to product/package design and BOMsets selection.
• Strong analytical skills, ability to deal with conflict. Live up tohigh quality standards. Good quality mind-set and excellent problemsolving.
• Strong in communication and people interpersonal skills across all levels. Experience in Subcon management.
  
  

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.