Sr. Director, Assembly Process Innovation

NXP Semiconductors


Date: 3 weeks ago
City: Kuala Lumpur
Contract type: Full time
Role Summary

  • Lead a cross culture team (Kuala Lumpur, Malaysia; Bangkok, Thailand; Kaohsiung, Taiwan; and Tianjin, China) to introduce new packaging and products into NXP’s four internal assembly & test factories
  • The role need to be able to motive and develop the team to the next level in technical and stakeholder management to achieve the company’s goals
  • This team is manufacturing facing role, handing-off new processes, products, and technologies to the internal factories. Also engaged in selecting new equipment platforms. Key stakeholders also include Quality, other Package Innovation teams (business-facing and central), Procurement, etc.

Job Description

  • Spearhead packaging technology and process technology development to support product roadmap requirements for NXP’s internal AT manufacturing facilities.
  • Lead new technology and new product introductions with first pass qualification and safe launch success in a high-volume manufacturing environment.
  • Cultivate intrapreneurship in the team for both legacy and advanced packaging innovations that are competitive to contribute to NXP’s product roadmap, growth, and cost structure.
  • Forge collaborative partnerships both internally and externally for new capabilities and opportunities that help address NXP’s business, quality, efficiency, etc. goals.
  • Travel up to 25% to maintain and build relationships at the four factories and with Europe- and US-based stakeholders.

Job Qualification

  • Bachelor or above degree in Engineering major.
  • 10+ technical experience and expertise in packaging and assembly technology.
  • 3+ years of leadership experience in leading a group of managers.
  • Strong organizational leadership skills.
  • Strong execution focus along with the ability to inspire, engage, and motivate.
  • Strong communication and stakeholder management and influencing skills. Ability to identify, drive, and balance organization performing and transforming objectives and initiatives.
  • Good business acumen and packaging technical know-how.

More information about NXP in Malaysia...

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