Sr. Director, Assembly Process Innovation
NXP Semiconductors
Date: 20 hours ago
City: Kuala Lumpur
Contract type: Full time
Role Summary
- Lead a cross culture team (Kuala Lumpur, Malaysia; Bangkok, Thailand; Kaohsiung, Taiwan; and Tianjin, China) to introduce new packaging and products into NXP’s four internal assembly & test factories
- The role need to be able to motive and develop the team to the next level in technical and stakeholder management to achieve the company’s goals
- This team is manufacturing facing role, handing-off new processes, products, and technologies to the internal factories. Also engaged in selecting new equipment platforms. Key stakeholders also include Quality, other Package Innovation teams (business-facing and central), Procurement, etc.
- Spearhead packaging technology and process technology development to support product roadmap requirements for NXP’s internal AT manufacturing facilities.
- Lead new technology and new product introductions with first pass qualification and safe launch success in a high-volume manufacturing environment.
- Cultivate intrapreneurship in the team for both legacy and advanced packaging innovations that are competitive to contribute to NXP’s product roadmap, growth, and cost structure.
- Forge collaborative partnerships both internally and externally for new capabilities and opportunities that help address NXP’s business, quality, efficiency, etc. goals.
- Travel up to 25% to maintain and build relationships at the four factories and with Europe- and US-based stakeholders.
- Bachelor or above degree in Engineering major.
- 10+ technical experience and expertise in packaging and assembly technology.
- 3+ years of leadership experience in leading a group of managers.
- Strong organizational leadership skills.
- Strong execution focus along with the ability to inspire, engage, and motivate.
- Strong communication and stakeholder management and influencing skills. Ability to identify, drive, and balance organization performing and transforming objectives and initiatives.
- Good business acumen and packaging technical know-how.
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