Staff Engineer Unit Process Engineering Die Attach

Quality improvement activities on DDM investigation, disposition and improvement In your new role you will:

• Yield improvement activities for Die Attach process
• Sustain and achieve stability index for package under responsibility
• Support production on daily issues investigation and improvement in order to achieve Operation performance
• Sustain and achieve quality stability for DPAK module DA process to achieve zero spill, FAR
• Documents update and refine to ensure no expired documents.
  
  

You are best equipped for this task if you have:

• Bachelor degree in engineering
• Knowledge in die attach process and skill
• ESEC 2007/2009 Soft Solder and Diffusion Soldering
• Knowledge in process engineering
• Basic statistical and SPC knowledge
• Basic problem solving skill 8D, MRB, DMAIC
  
  

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.