Staff / Principal / MTS - Process Development (BEOL)
X-FAB Sarawak
Date: 1 week ago
City: Kuching
Contract type: Full time
Kuching, Malaysia
Your Role
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Your Role
- To plan, develop and implement individual / organizational development plan of PD module MBOs.
- Focus will be on Back End Of Line (BEOL) development - from SILICIDE through CONTACT, METALISATION and PASSIVATION loops.
- Acquire from our technology partner (internal / external) the knowledge necessary for the successful transfer or development of technology.
- Support/work the development of new processes and transfer project based on customers’ need.
- Coordinate available resources from the process engineering, product engineering, FA and manufacturing group in troubleshooting, resolving issues, process improvement and yield enhancement.
- Enhance the yield and reliability of the acquired technology and process.
- DOE design for technology optimization. Qualify the acquired technology successfully in company.
- Transfer developed process to YE and support stabilization.
- To contribute towards the achievement of quality objectives by complying to the quality operating system and participating in continuous improvement activities (defect prevention, reduction of variation or prevention of waste).
- To contribute towards the achievement of the EHS objectives by complying to the EHS policy and participating in the implementation of EHS management system.
- Any other assignment deems fit that shall be given to you from time to time.
- Bachelor’s Degree or higher in Engineering / Science and preferably with 12 years of working experiences in semiconductor device physics & process integration.
- Skills/Competencies:
- Test pattern design for electrical & process monitoring.
- Job view for GDS data & MEBES data.
- TCAD simulation Semiconductor device physics and process simulation skills.
- Understanding of the procedure of the development and transfer.
- Knowledge of semiconductor physics, device and reliability technology.
- Knowledge of Package technology (Wire Bond, Wafer Level Package) would be advantageous.
- Knowledge of MEMS technology would be advantageous.
- Computer literacy in Microsoft Excel, Word, Power Point and Outlook.
- Excellent communication / presentation skills.
- Fluent in English, written and spoken.
- Good leadership and organizing abilities.
- Strong administration skills – planning / organizing / coordination & documentation.
- Customer service skills – serve internal customers.
- Teamwork and collaboration skills.
- Based at Kuching, Sarawak.
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