Staff / Principal / MTS - Process Development (BEOL)

X-FAB


Date: 4 days ago
City: Kuching
Contract type: Full time
Kuching, Malaysia

Your Role

  • To plan, develop and implement individual / organizational development plan of PD module MBOs.
  • Focus will be on Back End Of Line (BEOL) development - from SILICIDE through CONTACT, METALISATION and PASSIVATION loops.
  • Acquire from our technology partner (internal / external) the knowledge necessary for the successful transfer or development of technology.
  • Support/work the development of new processes and transfer project based on customers’ need.
  • Coordinate available resources from the process engineering, product engineering, FA and manufacturing group in troubleshooting, resolving issues, process improvement and yield enhancement.
  • Enhance the yield and reliability of the acquired technology and process.
  • DOE design for technology optimization. Qualify the acquired technology successfully in company.
  • Transfer developed process to YE and support stabilization.
  • To contribute towards the achievement of quality objectives by complying to the quality operating system and participating in continuous improvement activities (defect prevention, reduction of variation or prevention of waste).
  • To contribute towards the achievement of the EHS objectives by complying to the EHS policy and participating in the implementation of EHS management system.
  • Any other assignment deems fit that shall be given to you from time to time.

Your Profile

  • Bachelor’s Degree or higher in Engineering / Science and preferably with 12 years of working experiences in semiconductor device physics & process integration.
  • Skills/Competencies:
  • Test pattern design for electrical & process monitoring.
  • Job view for GDS data & MEBES data.
  • TCAD simulation Semiconductor device physics and process simulation skills.
  • Understanding of the procedure of the development and transfer.
  • Knowledge of semiconductor physics, device and reliability technology.
  • Knowledge of Package technology (Wire Bond, Wafer Level Package) would be advantageous.
  • Knowledge of MEMS technology would be advantageous.
  • Computer literacy in Microsoft Excel, Word, Power Point and Outlook.
  • Excellent communication / presentation skills.
  • Fluent in English, written and spoken.
  • Good leadership and organizing abilities.
  • Strong administration skills – planning / organizing / coordination & documentation.
  • Customer service skills – serve internal customers.
  • Teamwork and collaboration skills.
  • Based at Kuching, Sarawak.

Contact person : Kristina Sim

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