Staff Engineer Unit Process Development Wire Bond

Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturability.

Your Role

Key responsibilities in your new role

• Identify and develop new Process technology and improve Process capability to meet new requirements from Business divisions, responsible for technical handshake and knowledge transfer to Operation.
• Provide inputs for updating of related documents and is responsible for their correct contents, eg Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, etc for development projects.
• Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects.
• Participate task force / focus team and complex problem solving team using Statistical and analytical tools, eg SPC, APC, DOE, 8D, FMEA,DFMEA,
• Initiating and generating Intellectual Property (IP) ideas based on research, able to contribute to decision making in the field of knowledge.
• Support the definition of Process technology, material, machine and tooling, provide technical guidance/buddy to new engineers and team.
  
  

Your Profile

Qualifications And Skills To Help You Succeed

• Masters / Bachelor's Degree in Engineering or relevant course with 6 years of experience in semiconductor manufacturing with good package manufacturing knowledge and unit process development know-how, particularly on Aluminum wedge bond process.
• Advance problem solving and analytical skills with strong industry technical know how.
• Strong hands-on knowledge and skills in assembly area.
• Good aptitude for collaboration, negotiation and solution finding.
• Analytical equipment knowledge.
• Statistical data analysis including design of experiment.
  
  

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