Assembly Engineering Manager
NXP Semiconductors
Date: 4 days ago
City: Kuala Lumpur
Contract type: Full time
Job Description
- Reporting to Director, Assembly Engineering
- Knowledge of various equipment mold technology: Leaded, Leadless, In-line.
- Responsible as Mold UG leader (Chair) for Molding across A&T sites.
- Liaise with factory engineering teams and ensure cross-site coordination.
- Drive quality, cost and productivity improvement initiatives, may work in partnership with other functional groups i.e. IE /QA /Package Innovation Global Procurement etc
- Able review detailed product requirements & generate equipment technical specifications.
- Knowledge in materials properties on molding compound.
- Manage and aligned the Equipment Life Cycle Management (LCM) with Package Roadmap.
- Supervise equipment benchmarking at backend sites.
- Work with key Equipment OEM headquarters for total NXP support.
- Other responsibilities may be assigned over time as needed and applicable.
- Process or Equipment engineer with 10 years’ experience or more.
- Equipment automation /integration related experience will be added advantage.
- Project management experience will be an advantage.
- Previous direct project work with suppliers on quality or productivity improvement projects.
- Strong Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems.
- Cross cultural work experience
- Bachelor’s Degree in Engineering or Science in technical discipline.
- 6 sigma green belt or above certified recommended.
- Good communication skills, knowledge in multi-languages will be an advantage.
- Self-motivated working style & able to work independent, delivery of KPI’s expected.
- Possess good collaboration skills & ability to promote strong teamwork across multi-cultural teams.
- Ability to travel as need arises to support cross site projects
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