Process Engineer
NXP Semiconductors
Date: 3 weeks ago
City: Kuala Lumpur
Contract type: Full time
- Responsible for supporting New Package development of processes in automotive applications.
- Responsible for quality, yield, cost and process improvement activities.
- Responsible for process documentation, process spec, standard work instruction, OCAP, Lead etc.
- Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
- Take ownership to work closely with upper management to align scope and direction of key projects.
- Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
- 1-2 years of work experience with semiconductor assembly background for automotive customers.
- Experience in MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
- Good technical knowledge and hands-on experience in semiconductor manufacturing processes, such as saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
- Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success.
- Good SPC, Process Control and other relevant statistical & problem-solving skills
More information about NXP in Malaysia...
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