RELIABILITY LTE ENGINEER

NXP Semiconductors


Date: 3 weeks ago
City: Kuala Lumpur
Contract type: Full time
Job Description

  • Develop Reliability biasing stress board for NPI/NTI products align with JEDEC and customer specification.
  • Cooperate with multinational product development team including Design and Quality and work with external manufacturers on board fabrication
  • Develop program in C language with new product development team for reliability stress
  • Validate device on bench and reliability stress equipment to ensure device operation stability and provide final validation report.
  • Debug and troubleshoot on failure DUT, board, equipment & machine using various tools such as thermal imaging camera & oscilloscope
  • Work with cross department team including Failure Analysis & Business Line to analyze qualification failure using 8D methodology, FMEA, Fault Tree Analysis, & 3x5 Why tools.
  • Provide guidance to technician on biasing execution procedure and sustaining activities related to reliability biasing boards.

Requirement

  • Bachelor’s degree in Electrical and Electronics Engineering or equivalent.
  • 3-5 years’ experience in semiconductor reliability assessment field are preferred.
  • Knowledge in PCB fabrication, schematic, & layout.
  • Good programming knowledge (C language).
  • Experience with embedded system will be an added value.
  • Experience with life test reliability equipment & methodology will be an added value (HTOL, HAST, THB)

Note: Fresh Graduates are encouraged to apply. Grade level will be based on skills and experience. Only short-listed candidates will be notified

More information about NXP in Malaysia...

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