Senior Engineer Package Technology
Infineon Technologies
Date: 21 hours ago
City: Malacca
Contract type: Full time
Technical expert for lead frame / Substrates / packing material in package development projects.
Job Description
In your new role you will:
You are best equipped for this task if you have:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Job Description
In your new role you will:
- Perform design, drawing and specification for lead frame / substrates based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
- Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.
- Drive lead frame / substrates / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM).
- Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame / substrates / packing material; and qualification release.
- Establish design guideline / requirement for lead frame / substrates/ packing material specification.
- Generate technical papers / journals and patents related to lead frame design / substrates / package design that enhances technical value.
You are best equipped for this task if you have:
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
- More than 5 years of working experience in semiconductor assembly and packaging development; and relevance experience in Lead Frame /substrate / Packing Material is preferred.
- Lead Frame / substrate design / packing material development &qualification.
- Drafting / designing (2D/3D) Lead Frame using AutoCAD / Inventor /Cadence.
- Knowledge in material physics / properties for Lead Frame /substrates and packing material.
- GD&T knowledge / material specification definition.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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