Senior Engineer Package Technology

Technical expert for lead frame / Substrates / packing material in package development projects.

Job Description

In your new role you will:

• Perform design, drawing and specification for lead frame / substrates based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
• Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.
• Drive lead frame / substrates / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM).
• Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame / substrates / packing material; and qualification release.
• Establish design guideline / requirement for lead frame / substrates/ packing material specification.
• Generate technical papers / journals and patents related to lead frame design / substrates / package design that enhances technical value.
  
  

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• More than 5 years of working experience in semiconductor assembly and packaging development; and relevance experience in Lead Frame /substrate / Packing Material is preferred.
• Lead Frame / substrate design / packing material development &qualification.
• Drafting / designing (2D/3D) Lead Frame using AutoCAD / Inventor /Cadence.
• Knowledge in material physics / properties for Lead Frame /substrates and packing material.
• GD&T knowledge / material specification definition.
  
  

#WeAreIn for driving decarbonization and digitalization.

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Are you in?

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