Senior Engineer Unit Process Engineering Wire Bond
Infineon Technologies
Date: 13 hours ago
City: Malacca
Contract type: Full time
Wire Bond expert, responsible to achieve robust and auto-pilot processes.
Job Description
In your new role you will:
You are best equipped for this task if you have:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Job Description
In your new role you will:
- Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and yield.
- Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
- Accountable and drive for 8D closure of FAR, MRB, DDM and SDCAR.
- Leading and participating in yield & quality improvement and cost reduction activities.
- As a technical expert in new material, process and method qualification.
- Provide technical consultation and guidance team to ensure team success in daily tasks and projects.
You are best equipped for this task if you have:
- Bachelor's or Master degree in Mechanical, Manufacturing, Electronics or related Engineering.
- More than 3 years related experience in Assembly packaging or Semiconductor manufacturing background.
- Wire Bond Process
- Process & product control.
- Productivity/process improvement.
- Equipment Integration.
- Data Analysis (Statistical methods, data mining)
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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