Senior Staff Engineer Package Technology

To define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realisation.

Your Role

Key responsibilities in your new role

• Driver for technical definition (BOM, package design, Assembly technology, review PRP & project classification) activities for package projects with major changes/new package, risks and impact.
• Generate conceptual package outline and internal construction drawings, finalise and document the drawings and update the package drawings as needed.
• Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
• Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
• Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
• Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
  
  

Your Profile

Qualifications And Skills To Help You Succeed

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical & Electronics Physics).
• At least 9 years of relevant working experience in IC/semiconductor environment.
• Semiconductor Packaging, Assembly and Test.
• Process and Equipment Engineering knowledge.
• Failure Analysis and Reliability Engineering.
• AutoCAD and 3D drafting preferred.
  
  

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