Sr. Director, Assembly Process Innovation

NXP Semiconductors


Date: 3 days ago
City: Kuala Lumpur
Contract type: Full time
Position Description

The Senior Director, Assembly Process Innovation leads a team of 100+ engineers and technicians to introduce new packaging and products into NXP’s four internal assembly & test factories. The teams reside in Kuala Lumpur, Malaysia; Bangkok, Thailand; Kaohsiung, Taiwan; and Tianjin, China. This is a 3rd-line management position (manager of managers of managers) reporting to the Senior Vice President of Package Innovation in the organization led by NXP’s Chief Technology Officer. The key stakeholders/interfaces of this role are the leadership teams of the four factories, the manufacturing and supplier quality teams, and the business-aligned and central teams in Package Innovation.

Position Objectives / Deliverables

  • Spearhead packaging technology and process technology development to support product roadmap requirements for NXP’s internal AT manufacturing facilities.
  • Lead new technology and new product introductions with first pass qualification and safe launch success in a high-volume manufacturing environment.
  • Cultivate intrapreneurship in the team for both legacy and advanced packaging innovations that are competitive to contribute to NXP’s product roadmap, growth, and cost structure.
  • Forge collaborative partnerships both internally and externally for new capabilities and opportunities that help address NXP’s business, quality, efficiency, etc. goals.
  • Travel up to 25% to maintain and build relationships at the four factories and with Europe- and US-based stakeholders.

Competences / Skills Desired

  • Strong organizational leadership skills. Strong execution focus along with the ability to inspire, engage, and motivate.
  • Strong communication and stakeholder management and influencing skills.
  • Ability to identify, drive, and balance organization performing and transforming objectives and initiatives.
  • Good business acumen and packaging technical know-how.

Background / Experience Desired

  • 10+ technical experience and expertise in packaging and assembly technology.
  • 3+ years of leadership experience in leading a group of managers.

More information about NXP in Malaysia...

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