Staff Engineer Package Technology
Infineon Technologies
Date: 22 hours ago
City: Malacca
Contract type: Full time

Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification) activities for package projects with major changes/new package, risks and impact.
Job Description
In your new role you will:
You are best equipped for this task if you have:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Job Description
In your new role you will:
- Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed. Experience on laminate or MIS is preferred.
- Coordinate the package Cost Estimation (A1-A3) and Cost Indication(A3).
- Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
- Support pre development & project definition stage, and continue to be package design expert throughout project phase
- Consolidate the inputs for Automated Design Rules and ensure the contents are updated.
You are best equipped for this task if you have:
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics, Chemical Engineering)
- Knowhow in semiconductor Packaging, Assembly and Test with at least5 years of experience and knowhow of either laminate or MIS is preferred.
- Process and Equipment Engineering knowledge.
- Knowledge on Failure Analysis and Reliability Engineering.
- Possesses good Analytical and Problem Solving Skills.
- AutoCAD and 3D drafting skill is preferred.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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