Wire Bond Development Engineer

Key Responsibilities:

• Develop/Optimize new process window for new BPO/BPP on Au & Cu wires, new Al heavy wire / ribbon bonding etc.
• Design feasibility – Review bond Pad Metallization & Dimension & work with tools supplier to obtain suitable capillary type & wire bonding parameter for DOE
• Review and re-optimize tooling design on Top Plate & Window Clamp if needed to improve wire bond output response.
• Basic knowledge on Problem solving, Process capability study, Material technology, Equipment engineering, FMEA / 4M / 8D / DOE / SPC, etc.
• Direct discussion with Customer thru email or call for wire bond related subject if case needed.
• Develop new process and source for materials, equipment for continuous breakthrough improvement.
• Ensure 5s implementation and enforcement.
• Quality accountability:

1. disposition of non-conforming product per procedure.
2. enforce compliance to Machine Operating Procedure (MOP) and process specifications.
3. risk assessment for quality issues requiring product recall.
4. enforce compliance and monitor process performance.
5. establish mop for new process.
6. trigger quality incidences for visibility and action.
7. root cause analysis and ensure data integrity.
8. communicate quality alert / changes to subordinates and peers in a timely manner.

Any other duties assigned by immediate superior.

Requirements:

• Degree in Engineering or equivalent
• Minimum 2 years of working experience in front-of-line (FOL) assembly process and/or Semiconductor Wire bond process.
• Hands on wire bond process optimization & development, especially ASM machines
  - Possess process optimization and analysis skills e.g. DOE, statistical analysis with JMP or other statistic software.
  - Knowledge of SPC, FMEA, Design-of-Experiments (DOE)