Wire bond Equipment engineering

NXP Semiconductors


Date: 2 weeks ago
City: Kuala Lumpur
Contract type: Full time
  • BGA - Equipment Engineer managing wire bond and WB AOI equipment.
  • In-charge / holding primary role to drive for Wire Bonder & WB AOI Machines good performance to meet good quality product, output and cycle time.
  • Collaboration with API and NPI team on new product equipment set up and buy off.
  • Leading a group of wire bond technician to maintain machine performance through preventive maintenance and predictive maintenance.
  • Monitor equipment indices and improvement plans to continue improve machine Downtime/MTBA/PM success rate.
  • Responsible for equipment incurred quality incident investigation & CAPA.
  • In-charge for new bonder, new software installation, buyoff & qualification.
  • Responsible for equipment related document release & update (WI, ERA, PM & etc.).
  • Involve in all the quality audits (GMA, IATF, Customers) and & 5S audit.
  • Support department automation project at wire bonder & AOI machine.
  • Identify and mitigate risk areas where the equipment or the methodologies in maintaining the equipment can cause quality or productivity problems.

Requirements

  • Bachelor of Engineering (Hons) in Electrical / Mechanical / Mechatronic.
  • Fresh Graduate / 1-2 years of working experience in wire bond (preferably Cu wire).
  • Able to read, write and converse in English and Bahasa Malaysia.
  • Equipment experience with KNS wire bonder (ICONN series & RAPID) / wire bond AOI machine.
  • Able to do presentation to a big group of employees.
  • Experience in DMAIC, 5 Why, FTA analysis tool & EFMEA.
  • Strong knowledge in equipment stability (MTBA/MTBF, OEE & Equipment Cpk)
  • Have a good interpersonal skill & able to work independently with minimum supervision.
  • Strong knowledge in Microsoft Office (Word excel, PowerPoint)
  • Artificial Intelligence(AI),Power BI and/or SAP background will be an advantage.

More information about NXP in Malaysia...

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