Flipchip Assembly Process Engineer
NXP Semiconductors
Date: 1 day ago
City: Kuala Lumpur
Contract type: Full time
Oversees and assesses FC Lid Attach and Laser Mark on yield, Leading indicator, Cost Down, and workflows. Optimizes productivity by designing, implementing and testing new procedures.
Key Accountabilities
Key Accountabilities
- Identify and implement process improvement activities through defined methodology
- Ability to think innovatively to improve process and procedures.
- Handle and investigate quality issues including low yield or maverick cases
- Technical Lead assembly related issues or cost reduction projects
- Lead and share knowledge with process and equipment team
- Excellent analytical and Data interpretation skills
- Good SPC, Process Control and other relevant statistical & problem solving skills
- Good knowledge in material science especially metallurgy
- Good communication, interpersonal skills with leadership ability.
- Excellent verbal and written communication skills.
- Demonstrated effective presentation capability.
- Advanced knowledge of semiconductor manufacturing flow and MS Office skills (Excel, PowerPoint, Word and Outlook).
- Ability to work odd hours if needed
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