Senior Project Manager Project Management

Job Description

In your new role you will:

• Managing test and package development execution within product/technology development according to project milestone, quality & cost requirements.
• Aligned with chip/system development, test engineering and related subject matter experts for all technical, cost and quality aspects during project phase.
• Support Package Definition group to ensure package platform complexity, product requirement, customer commitment are met with respect to test-related issues.
• Problem solving and trouble shooting of test development-related issues.
• Responsible for samples, qualification build-up & transfer into manufacturing engineering.
• Responsible for project cost (NRE/Capital) planning, management and request for approval.
• Responsible for regular Project status reporting and milestone release to Project Owner / Stakeholders / Respective Release Board.
• Driving Strategic and Cost-down Test projects aligned to Infineon long-term Test roadmap and Productivity improvements at Subcon sites orin-house testing (for non-full turn key model)
• United within DEV PJM team in collaboration with DMR, OSAT Sustaining and other stakeholders for new test development from development process, post-concept approval to launch.
• Responsible to ensure project execution is running within timeline,budget and technical & Quality standards are achieved to maximize profitability.
• Bring IFX team and subcon counterparts together to ensure proper project execution and fulfilment of project deliverables within team members, BU partner and other interfaces.
• Proactive and effective technical and project risk management to mitigate / minimize impact on project targets, with timely escalation as and when needed
• Regular project status reporting to key stakeholders, flexibility toadapt project plan based on situational developments
  
  

Your Profile

You are best equipped for this task if you have:

• Masters/Bachelor’s Degree in Engineering and Physical Science or equivalent with at least 6 years of relevant working experience and there of at least 4 years of leading projects
• Experience in OSAT test and backend semiconductor packaging project management, cost-down / productivity, new process and package platform qualification / line transfer will be an added advantage
• Experience in semiconductor R&D in packaging group
• Has very good project management knowledge in terms of project initiation, planning and closing including reporting and documentation
• Analytical mind and high initiative to challenge him/herself and the team to move the next level of competency.
• Experience in analytical tool, e.g. Surface analysis, material characterisation, DoE, D/PFMEA, 8D and simulation knowledge will be an added advantage
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

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